Direct answer
PCBA buyers should not treat IEC 61760-1:2026 as a general supplier certificate. Use it to update BOM and process-compatibility reviews when a contract or component specification invokes it, or when a build uses a changed process area. IEC published Edition 4.0 on June 23, 2026, replacing the 2020 edition.
What changed
IEC 61760-1 covers surface-mount component specifications and reference process and test conditions. IEC’s public change list adds assembly classification, insulation coordination, thermal and electrical performance, low-temperature solders, common solder alloys, resistance to vacuum, liquid-cleaning tests, rework and sustainability.
The standard does not require every assembly line to adopt low-temperature solder. It is also not a finished-PCBA acceptance standard and does not, by itself, prove that a component or assembler is qualified for a particular product.
Why this matters to PCB and PCBA buyers
An orderable, dimensionally correct component may still be unsuitable for the planned solder profile, alloy, cleaning medium, vacuum step or rework exposure. That mismatch may cause damage or post-shipment reliability risk. Purchasing must connect the exact BOM item to the assembly recipe and end-use requirements, not merely approve an alternative on form and fit.
Five checks before releasing a build
Check 1. Record whether the drawing, component specification, purchase order or customer requirement invokes IEC 61760-1:2026. If a project is transitioning from the 2020 edition, agree the effective build, allowed exceptions and approval owner.
Check 2. For process-sensitive SMDs, obtain the exact manufacturer part number, package and manufacturer limits for solder temperature, exposure time, permitted cycles, cleaning, vacuum and rework. Do not approve an alternate solely because its footprint matches.
Check 3. Link the approved solder alloy and paste, peak temperature, time above liquidus, atmosphere, cleaning medium, vacuum operation and maximum rework cycles to documented evidence. If low-temperature solder is proposed, validate joint and system reliability for the intended use.
Check 4. Review creepage, clearance and insulation needs at component-to-board interfaces. Define operating voltage, pollution or contamination assumptions, coating and cleaning conditions, and the applicable verification criteria.
Check 5. Use a pilot or NPI build to capture thermal profiles, inspection and test results, deviations and lot traceability. Freeze the approved recipe and require customer approval before material or process changes.
JETFGO connection
JETFGO’s public PCB Assembly page states that its PCBA workflow can include component sourcing, SMT, THT, mixed assembly, inspection and testing. It also says engineering review covers Gerber files, BOM, pick-and-place data, assembly drawings, component availability and test requirements, while project-specific quality planning can include SPI, AOI, X-ray, electrical testing, ICT and FCT. The page does not state IEC 61760-1:2026 qualification. Buyers should therefore put the required revision, component process limits, approved alloy, cleaning and rework rules, and acceptance evidence directly in the RFQ.
Conclusion
The sourcing decision is not whether a supplier recognizes the standard number. It is whether the exact BOM, board design and documented assembly process are compatible, verified and controlled for the released build.
Source 1. IEC 61760-1:2026 CMV, Surface mounting technology, Part 1, official IEC publication page. Publication date: June 23, 2026. This page identifies Edition 4.0 and lists the principal technical changes. https://webstore.iec.ch/en/publication/114458
Source 2. IEC 61760-1:2020, official IEC publication page. This page shows the 2020 edition as withdrawn on June 23, 2026 and points to the 2026 version. https://webstore.iec.ch/en/publication/60478
Source 3. JETFGO PCB Assembly and PCBA Manufacturing Services, current English page used only for JETFGO’s publicly stated assembly workflow, review inputs, inspection and test options. https://jetfgo.online/en/products/pcb-assembly
Source 4. JETFGO Electronic Component Sourcing for PCBA, current English page used only for JETFGO’s publicly stated BOM review, component control and alternate-approval workflow. https://jetfgo.online/en/products/component-sourcing