Productos y aplicaciones

High Speed Board

Layers: 24 Material: FR-4 Panasonic M6 Surface Finish:ENIG Board Thickness: 3mm Minimum Hole: 0.25mm Line Width Space: 3.5 / 3.5mil Special Technology: Via in PAD, Back drilling, Depth milling, Impedance

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JETFGO / High Speed Board

PRODUCT & PROCESS DETAIL

PRODUCT / PROCESS DATA

Layers24 Material: FR-4 Panasonic M6 Surface Finish:ENIG Board Thickness: 3mm Minimum Hole: 0.25mm Line Width Space: 3.5 / 3.5mil Special Technology: Via in PAD, Back drilling, Depth milling, Impedance

E-mail： sal@jetfgo.com

Tel： 0755-23300780 / 23302390

Fax： 0755-23302910

Add： Building 18, District 1, Xinhe Xinxing Industrial Park, Fuhai Street, Baoan District, Shenzhen

Galería de productos y fábrica

High Speed Board

RFQ / DFM

Envíe el requisito. Reciba un plan de suministro fabricable.

Envíe Gerber u ODB++, stackup, material, cantidad, fecha objetivo y pruebas para revisar la viabilidad y cotizar.

Revisión técnicaMaterial y stackupFabricación precisa

Contactosal@jetfgo.com Abrir checklist RFQ