Produits et applications

High Speed Board

Layers: 24 Material: FR-4 Panasonic M6 Surface Finish:ENIG Board Thickness: 3mm Minimum Hole: 0.25mm Line Width Space: 3.5 / 3.5mil Special Technology: Via in PAD, Back drilling, Depth milling, Impedance

Devis direct du fabricant

JETFGO / High Speed Board

PRODUCT & PROCESS DETAIL

PRODUCT / PROCESS DATA

Layers24 Material: FR-4 Panasonic M6 Surface Finish:ENIG Board Thickness: 3mm Minimum Hole: 0.25mm Line Width Space: 3.5 / 3.5mil Special Technology: Via in PAD, Back drilling, Depth milling, Impedance

E-mail： sal@jetfgo.com

Tel： 0755-23300780 / 23302390

Fax： 0755-23302910

Add： Building 18, District 1, Xinhe Xinxing Industrial Park, Fuhai Street, Baoan District, Shenzhen

Galerie produits et usine

High Speed Board

RFQ / DFM

Envoyez le besoin. Recevez un plan d’approvisionnement fabricable.

Envoyez Gerber ou ODB++, empilage, matériaux, quantité, date cible et tests pour étude et devis technique.

Revue techniqueMatériaux et empilageFabrication précise

Contactsal@jetfgo.com Ouvrir la checklist RFQ