Products & applications

High Speed Board

Layers: 24 Material: FR-4 Panasonic M6 Surface Finish:ENIG Board Thickness: 3mm Minimum Hole: 0.25mm Line Width Space: 3.5 / 3.5mil Special Technology: Via in PAD, Back drilling, Depth milling, Impedance

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JETFGO / High Speed Board

PRODUCT & PROCESS DETAIL

PRODUCT / PROCESS DATA

Layers24 Material: FR-4 Panasonic M6 Surface Finish:ENIG Board Thickness: 3mm Minimum Hole: 0.25mm Line Width Space: 3.5 / 3.5mil Special Technology: Via in PAD, Back drilling, Depth milling, Impedance

E-mail： sal@jetfgo.com

Tel： 0755-23300780 / 23302390

Fax： 0755-23302910

Add： Building 18, District 1, Xinhe Xinxing Industrial Park, Fuhai Street, Baoan District, Shenzhen

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High Speed Board

RFQ / DFM

Discuss your next order directly with our factory.

Send the Gerber or ODB++, stackup, material, quantity, target date and test requirements. Our team will review feasibility and return a technical quotation for the order you manage.

Engineering reviewMaterial & stackupPrecision fabrication

Contactsal@jetfgo.com Open RFQ checklist