Explore JETFGO's PCB manufacturing capabilities, including multilayer, HDI, high-frequency, flexible, rigid-flex and metal-base PCBs, plus PCB assembly and component sourcing services.
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PRODUCT & PROCESS DETAIL
Single-sided, double-sided and multilayer PCBs are fabricated to customer specifications for industrial, communications, computing and medical electronics. JETFGO supports prototypes and production orders from its Shenzhen factory.
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HDI PCBs use laser microvias, sequential lamination and fine-line routing to connect dense electronic designs. JETFGO manufactures custom HDI boards for prototypes, NPI and volume production.
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High-frequency RF PCBs use low-loss laminates and controlled impedance for communication, radar and microwave circuits. JETFGO reviews materials and stack-ups before custom fabrication.
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High-speed PCBs use low-loss materials and controlled impedance to support signal integrity in digital computing and data-communication systems. JETFGO fabricates customer-designed boards after stack-up review.
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Hybrid PCBs combine RF laminates and FR-4 within one board for applications needing different electrical material properties. JETFGO reviews mixed-material stack-ups for high-frequency and high-speed projects before fabrication.
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Rigid-flex PCBs combine rigid board sections and flexible circuits in one structure for compact electronics and complex interconnections. JETFGO reviews the layer stack-up and materials before custom fabrication.
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Flexible PCBs use polyimide materials and fine-feature circuits for compact electronics that need bendable interconnections. JETFGO supports custom flex-board projects from prototype through volume production.
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Metal-base PCBs use aluminum or copper substrates to manage heat in power electronics and other demanding assemblies. JETFGO reviews materials, thermal performance and layer structure before fabrication.
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Multilayer PCB manufacturing with advanced layer structures, engineering support, prototype capability and scalable production for industrial electronics.
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Copper inlay PCB manufacturing with embedded copper inserts for direct thermal management in high-power, automotive and industrial electronic applications.
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Substrate-like PCB (SLP) manufacturing with ultra-fine lines, laser microvias, any-layer interconnects and mSAP/amSAP processes for compact high-density electronics.
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ABF (Ajinomoto Build-up Film) IC package substrates provide fine-line interconnections for advanced semiconductor packaging. JETFGO reviews laser microvias, any-layer build-up and SAP/mSAP requirements before confirming project feasibility.
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Specialty PCBs are a category of custom boards, including heavy-copper, thermoelectric-separation, extra-thick, extra-long and reinforced structures for power, thermal and industrial applications. Each design receives engineering review before production.
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One-stop PCB assembly and PCBA services with component sourcing, SMT, THT, mixed assembly, inspection, testing, conformal coating and prototype-to-production support.
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BOM-based electronic component sourcing with MPN review, approved alternatives, traceability control and supply coordination for PCB assembly and PCBA production.
View detailsExplore JETFGO's PCB manufacturing technologies, product examples, process capabilities, factory equipment and quality systems to support PCB and PCBA sourcing decisions.
Send the Gerber or ODB++, stackup, material, quantity, target date and test requirements. Our team will review feasibility and return a technical quotation for the order you manage.
