Rogers RO4350B RF PCB is designed for high-frequency and microwave applications where low dielectric loss, controlled impedance and stable electrical performance are important to the signal path. RO4350B is part of the Rogers RO4000 series of high-frequency circuit materials. Rogers specifies a typical process dielectric constant (Dk) of 3.48 ±0.05 and a typical dissipation factor (Df) of 0.0037 at 10 GHz, providing a useful material platform for RF, microwave and antenna circuits. JETFGO reviews the complete RF PCB stack-up together with laminate selection, dielectric thickness, copper thickness, transmission-line geometry, reference planes and target impedance before confirming manufacturability. Our published manufacturing capability reference for this solution includes ±8% impedance tolerance and surface-finish options including ENIG, ENEPIG and immersion silver. Rogers RO4003C and RO4350B materials may be evaluated according to project requirements and material availability. For RF designs, the manufacturing data should identify target impedance, routing layers, reference planes, critical RF traces, copper requirements and any material-specific stack-up constraints. Hybrid constructions combining Rogers high-frequency laminates with FR-4 may also be reviewed when the design requires a mixed-material stack-up. For engineering review, provide Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date, target impedance and required Rogers laminate. Published capability values are provided for initial selection. Final material availability, stack-up, RF geometry, surface finish and manufacturing feasibility are confirmed through project-specific engineering and DFM review.
Published limits are drawn from JETFGO’s current capability chart. Final feasibility depends on the complete data package and engineering review.Rogers RO4350B RF PCB
A Rogers RO4350B RF PCB solution for microwave, antenna and high-frequency signal chains, with low-loss material, stack-up and controlled-impedance review before manufacturing.
Engineering answer
Verified process window
A Rogers RO4350B RF PCB solution for microwave, antenna and high-frequency signal chains, with low-loss material, stack-up and controlled-impedance review before manufacturing.
Material Family
Rogers RO4003C · RO4350B
Impedance Tolerance
±8%
Surface Finishes
ENIG · ENEPIG · Immersion Silver
RO4350B Process Dk
3.48 ±0.05 @ 10 GHz / 23°C
RO4350B Dissipation Factor
0.0037 @ 10 GHz
RF Engineering Review
Stack-up · impedance · dielectric · copper geometry
Files for a useful review
Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date, Rogers material requirement and applicable controlled-impedance specifications.
Specify RO4350B, RO4003C or other required laminate, including material thickness, copper weight and any approved substitution restrictions.
Provide target impedance, tolerance, routing layer, reference plane and applicable microstrip, stripline or differential RF transmission-line requirements.
Provide the proposed layer structure, dielectric thickness, copper thickness, RF routing layers and any Rogers-to-FR-4 hybrid construction requirements.
Technical questions
Published limits are drawn from JETFGO’s current capability chart. Final feasibility depends on the complete data package and engineering review.
01What is Rogers RO4350B PCB used for?+
Rogers RO4350B is a low-loss high-frequency laminate commonly used for RF, microwave, antenna, wireless communication and other circuits where controlled dielectric behavior and signal performance are important.
02Which files help JETFGO review a Rogers RO4350B RF PCB fastest?+
Send Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date, required Rogers laminate and all controlled-impedance requirements.
03Can JETFGO support prototypes and repeat production for Rogers RF PCBs?+
Yes. Once the Rogers material, stack-up, impedance requirements and manufacturing conditions are confirmed, the approved engineering record can support prototype validation and repeat production.
04What is the difference between RO4350B and RO4003C?+
Both belong to the Rogers RO4000 high-frequency laminate family, but they have different dielectric, loss and material characteristics. Material selection should be based on the RF design, stack-up, frequency range and project requirements.
05Can RO4350B be combined with FR-4 in a hybrid PCB stack-up?+
Yes, hybrid stack-ups combining Rogers high-frequency laminates with FR-4 can be evaluated when the design requires RF performance together with cost or structural considerations. Final compatibility depends on the complete stack-up and manufacturing process.
06What information is required for impedance control on an RO4350B RF PCB?+
Provide the target impedance, tolerance, routing layer, reference plane, Rogers material and thickness, copper requirements and relevant transmission-line geometry whenever available.
07Which surface finishes are available for Rogers RF PCBs?+
JETFGO can review surface finishes including ENIG, ENEPIG and immersion silver for Rogers RF PCB projects. Final selection should consider assembly, RF performance, bonding and application requirements.
Discuss your next order directly with our factory.
Send the Gerber or ODB++, stackup, material, quantity, target date and test requirements. Our team will review feasibility and return a technical quotation for the order you manage.