Material- und Impedanzkontrolle für Mikrowellen-, Antennen- und HF-Signalwege. Bestätigtes Prozessfenster: Material family: Rogers RO4003C · RO4350; Impedance tolerance: ±8%; Surface finishes: ENIG · ENEPIG · immersion silver Daten für die Prüfung: Gerber oder ODB++, Bohrdaten, Stack-up, Fertigungszeichnung, Menge und Zieltermin. Die veröffentlichten Grenzen stammen aus der aktuellen JETFGO-Fähigkeitsmatrix. Die endgültige Machbarkeit erfordert vollständige Daten.
Die veröffentlichten Grenzen stammen aus der aktuellen JETFGO-Fähigkeitsmatrix. Die endgültige Machbarkeit erfordert vollständige Daten.LösungscodeRF-4350Fähigkeit belegt
Rogers RO4350 HF-Leiterplatte
Material- und Impedanzkontrolle für Mikrowellen-, Antennen- und HF-Signalwege.
JETFGO / RF-4350RIGID
01 / TECHNISCHE ANTWORT
Technische Antwort
02 / DATA
Bestätigtes Prozessfenster
Material- und Impedanzkontrolle für Mikrowellen-, Antennen- und HF-Signalwege.
Material Family
Rogers RO4003C · RO4350B
Impedance Tolerance
±8%
Surface Finishes
ENIG · ENEPIG · Immersion Silver
RO4350B Process Dk
3.48 ±0.05 @ 10 GHz / 23°C
RO4350B Dissipation Factor
0.0037 @ 10 GHz
RF Engineering Review
Stack-up · impedance · dielectric · copper geometry
05 / INPUT
Daten für die Prüfung
RF PCB Engineering Package
Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date, Rogers material requirement and applicable controlled-impedance specifications.
Rogers Material Requirement
Specify RO4350B, RO4003C or other required laminate, including material thickness, copper weight and any approved substitution restrictions.
RF Impedance Requirements
Provide target impedance, tolerance, routing layer, reference plane and applicable microstrip, stripline or differential RF transmission-line requirements.
RF Stack-up Requirements
Angebot anfordernProvide the proposed layer structure, dielectric thickness, copper thickness, RF routing layers and any Rogers-to-FR-4 hybrid construction requirements.
06 / FAQ
Technische Fragen
Die veröffentlichten Grenzen stammen aus der aktuellen JETFGO-Fähigkeitsmatrix. Die endgültige Machbarkeit erfordert vollständige Daten.
01What is Rogers RO4350B PCB used for?+
Rogers RO4350B is a low-loss high-frequency laminate commonly used for RF, microwave, antenna, wireless communication and other circuits where controlled dielectric behavior and signal performance are important.
02Which files help JETFGO review a Rogers RO4350B RF PCB fastest?+
Send Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date, required Rogers laminate and all controlled-impedance requirements.
03Can JETFGO support prototypes and repeat production for Rogers RF PCBs?+
Yes. Once the Rogers material, stack-up, impedance requirements and manufacturing conditions are confirmed, the approved engineering record can support prototype validation and repeat production.
04What is the difference between RO4350B and RO4003C?+
Both belong to the Rogers RO4000 high-frequency laminate family, but they have different dielectric, loss and material characteristics. Material selection should be based on the RF design, stack-up, frequency range and project requirements.
05Can RO4350B be combined with FR-4 in a hybrid PCB stack-up?+
Yes, hybrid stack-ups combining Rogers high-frequency laminates with FR-4 can be evaluated when the design requires RF performance together with cost or structural considerations. Final compatibility depends on the complete stack-up and manufacturing process.
06What information is required for impedance control on an RO4350B RF PCB?+
Provide the target impedance, tolerance, routing layer, reference plane, Rogers material and thickness, copper requirements and relevant transmission-line geometry whenever available.
07Which surface finishes are available for Rogers RF PCBs?+
JETFGO can review surface finishes including ENIG, ENEPIG and immersion silver for Rogers RF PCB projects. Final selection should consider assembly, RF performance, bonding and application requirements.
RFQ / DFM
Anforderung senden. Einen fertigbaren Lieferplan erhalten.
Senden Sie Gerber oder ODB++, Aufbau, Material, Menge, Zieltermin und Prüfanforderungen für Machbarkeitsprüfung und Angebot.
Engineering-PrüfungMaterial & Stack-upPräzisionsfertigung