마이크로파, 안테나 및 RF 신호 체인을 위한 소재·임피던스 관리. 검증된 공정 범위: Material family: Rogers RO4003C · RO4350; Impedance tolerance: ±8%; Surface finishes: ENIG · ENEPIG · immersion silver 검토용 파일: Gerber 또는 ODB++, 드릴 파일, 스택업, 제작 도면, 수량 및 목표 일정. 게시된 한계는 JETFGO의 현재 공정 능력표를 기반으로 하며 최종 가능성은 전체 자료 검토 후 확정됩니다.
게시된 한계는 JETFGO의 현재 공정 능력표를 기반으로 하며 최종 가능성은 전체 자료 검토 후 확정됩니다.
JETFGO / RF-4350RIGID
01 / 엔지니어링 답변
엔지니어링 답변
02 / DATA
검증된 공정 범위
마이크로파, 안테나 및 RF 신호 체인을 위한 소재·임피던스 관리.
Material Family
Rogers RO4003C · RO4350B
Impedance Tolerance
±8%
Surface Finishes
ENIG · ENEPIG · Immersion Silver
RO4350B Process Dk
3.48 ±0.05 @ 10 GHz / 23°C
RO4350B Dissipation Factor
0.0037 @ 10 GHz
RF Engineering Review
Stack-up · impedance · dielectric · copper geometry
05 / INPUT
검토용 파일
RF PCB Engineering Package
Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date, Rogers material requirement and applicable controlled-impedance specifications.
Rogers Material Requirement
Specify RO4350B, RO4003C or other required laminate, including material thickness, copper weight and any approved substitution restrictions.
RF Impedance Requirements
Provide target impedance, tolerance, routing layer, reference plane and applicable microstrip, stripline or differential RF transmission-line requirements.
RF Stack-up Requirements
견적 요청Provide the proposed layer structure, dielectric thickness, copper thickness, RF routing layers and any Rogers-to-FR-4 hybrid construction requirements.
06 / FAQ
기술 질문
게시된 한계는 JETFGO의 현재 공정 능력표를 기반으로 하며 최종 가능성은 전체 자료 검토 후 확정됩니다.
01What is Rogers RO4350B PCB used for?+
Rogers RO4350B is a low-loss high-frequency laminate commonly used for RF, microwave, antenna, wireless communication and other circuits where controlled dielectric behavior and signal performance are important.
02Which files help JETFGO review a Rogers RO4350B RF PCB fastest?+
Send Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date, required Rogers laminate and all controlled-impedance requirements.
03Can JETFGO support prototypes and repeat production for Rogers RF PCBs?+
Yes. Once the Rogers material, stack-up, impedance requirements and manufacturing conditions are confirmed, the approved engineering record can support prototype validation and repeat production.
04What is the difference between RO4350B and RO4003C?+
Both belong to the Rogers RO4000 high-frequency laminate family, but they have different dielectric, loss and material characteristics. Material selection should be based on the RF design, stack-up, frequency range and project requirements.
05Can RO4350B be combined with FR-4 in a hybrid PCB stack-up?+
Yes, hybrid stack-ups combining Rogers high-frequency laminates with FR-4 can be evaluated when the design requires RF performance together with cost or structural considerations. Final compatibility depends on the complete stack-up and manufacturing process.
06What information is required for impedance control on an RO4350B RF PCB?+
Provide the target impedance, tolerance, routing layer, reference plane, Rogers material and thickness, copper requirements and relevant transmission-line geometry whenever available.
07Which surface finishes are available for Rogers RF PCBs?+
JETFGO can review surface finishes including ENIG, ENEPIG and immersion silver for Rogers RF PCB projects. Final selection should consider assembly, RF performance, bonding and application requirements.
RFQ / DFM
요구사항을 보내고 실행 가능한 공급 계획을 받으세요.
Gerber 또는 ODB++, 적층, 재료, 수량, 목표 일정과 검사 요구를 보내주시면 기술 검토 후 견적합니다.
기술 검토소재·스택업정밀 제조