다층 연성 PCB

A multilayer flexible PCB contains multiple conductive layers within a flexible polyimide-based structure, providing greater routing density while allowing the circuit to bend, fold or fit into compact assemblies.

Send Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date and any defined bend, flex-zone, coverlay, stiffener or assembly requirements.

Yes. Once the flex stack-up, materials, bend requirements and manufacturing conditions are confirmed, the approved engineering record can support prototype validation and repeat production under the same process conditions.

A flexible PCB uses flexible circuit construction throughout the relevant board area, while a rigid-flex PCB permanently combines rigid PCB sections and flexible interconnect sections within one integrated structure.

They can be evaluated for dynamic-flex applications, but final suitability depends on the flex stack-up, copper construction, bend radius, conductor routing, flex length and required movement cycle.

Provide the bend location, available bend radius, static or dynamic use, movement direction, flex-zone length and any restrictions on components, vias or plated features in the bending area.

Stiffeners reinforce selected flex PCB areas such as connectors, component locations or assembly interfaces where additional mechanical support or controlled thickness is required.

Yes. Increasing the number of conductive and dielectric layers generally increases the mechanical complexity of the flex structure, so bend performance must be reviewed together with total thickness, copper construction and intended movement.