PRODUCT & PROCESS DETAILTake a closer look at how JETFGO manufactures printed circuit boards in Shenzhen. Explore our production equipment, engineering processes and inspection systems, and see the manufacturing capabilities behind the PCBs we deliver to customers worldwide.
각 단계의 설비, 관리 지점 및 자체 공장 사진을 확인하세요.
01Incoming laminates, copper foils and other PCB materials are checked against approved specifications. Manufacturing files and material requirements are reviewed before production begins.
02Circuit patterns are transferred onto copper-clad laminates through imaging and etching processes. Inner-layer AOI verifies circuit geometry before multilayer lamination.
03Inner-layer cores and prepreg materials are stacked, aligned and bonded under controlled temperature and pressure to form a multilayer PCB structure.
04Mechanical drilling produces through-holes, while laser drilling supports suitable microvia structures. Desmear and through-hole metallization processes prepare the holes for reliable electrical interconnections.
05Outer-layer circuit patterns are formed through imaging, copper electroplating and selective etching. Process controls help maintain the specified conductor geometry and copper thickness.
06Solder mask protects the circuitry, while legend printing provides component markings. The specified surface finish is applied, followed by precision routing to the required board outline.
07Completed PCBs undergo applicable visual inspection, automated inspection and electrical testing. Flying probe or fixture-based testing verifies circuit connectivity against the approved manufacturing data.
08Approved PCBs are counted, identified and packaged according to customer requirements. Final documentation and shipment checks are completed before dispatch.
JETFGO의 공정 능력, 생산 설비, 검사 체계 및 제조 전문성을 확인하세요.
공장 부지, 생산 현장 및 설비의 실제 모습을 소개합니다.
사진을 준비 중입니다. 등록 후 공장 환경, 생산 현장 및 설비별로 표시됩니다.
생산 설비 · 검사 및 연구 장비
Equipment names, photographs and parameters are sourced from the published JETFGO department page and remain editable in the admin portal.
01The GKG fully automatic solder paste printer is used in JETFGO's SMT assembly lines to apply solder paste accurately onto PCB pads before component placement. With automated PCB alignment and precision printing control, the equipment supports consistent solder paste deposition, reduces printing defects and improves assembly process stability for fine-pitch components and high-density PCBAs.
02The Yamaha YSM20 automatic SMT pick-and-place machine is used in JETFGO's PCBA production lines for precise placement of surface-mount electronic components onto printed circuit boards. Supporting component sizes down to 01005 and a wide range of component types, the machine enables high-density PCB assembly, fine-pitch component placement and efficient SMT production. Its automated placement system supports consistent component positioning, reduces assembly errors and improves manufacturing efficiency for prototype, small-batch and repeat PCBA production.
03The automatic wave soldering machine is used in JETFGO's PCBA production lines for soldering through-hole (THT) electronic components onto printed circuit boards. The process uses controlled flux application, preheating and molten solder contact to form electrical and mechanical connections between component leads and PCB pads. With adjustable conveyor speed and controlled soldering conditions, the equipment supports consistent solder joint formation and efficient assembly of industrial control boards, power electronics and mixed-technology PCBAs. Key quality considerations include solder joint coverage, hole filling, solder bridging and thermal exposure. Process settings are adjusted according to PCB construction, component requirements and the approved assembly specifications.
04The Automated Optical Inspection (AOI) system is used in JETFGO's PCBA production lines to inspect component placement and visible solder-joint quality after SMT assembly. Equipped with a 5-megapixel camera and 20 μm imaging resolution, the system supports automated identification of missing components, placement deviations, tombstoning, polarity errors, visible component damage and soldering defects. AOI inspection helps detect potential manufacturing defects early, reduce manual inspection workload and improve consistency in PCB assembly quality. The equipment supports quality control for prototype, small-batch and repeat PCBA production, with inspection criteria configured according to component types, PCB layouts and customer requirements.
05The SMT Intelligent First Article Inspection (FAI) System is used in JETFGO's PCBA production lines to verify component parameters and assembly accuracy before batch production. Equipped with a high-precision LCR measurement system, the equipment supports resistance, capacitance and inductance verification against approved component specifications. First article inspection helps identify incorrect component values, material mismatches and potential assembly errors before mass production, reducing rework risks and improving manufacturing consistency. This inspection process supports quality control during new product introduction (NPI), production changeovers and repeat PCBA manufacturing.
06The fully automatic solder paste mixer is used in JETFGO's SMT production lines to prepare solder paste before stencil printing and electronic component assembly. The equipment provides controlled mixing to improve solder paste uniformity and consistency, helping maintain suitable printing conditions for accurate solder paste deposition on PCB pads. With a dual-can mixing capacity and adjustable operating time, the system supports efficient solder paste preparation for prototype, small-batch and repeat PCBA production. Consistent solder paste preparation helps reduce process variation and supports better solder paste printing quality. Mixing procedures are controlled according to solder paste specifications and production requirements.
07The Microfocus X-Ray Inspection System is used in JETFGO's PCBA quality control process to examine internal solder joints and electronic assembly features that cannot be directly inspected through conventional optical inspection. The equipment supports non-destructive inspection of hidden solder connections beneath BGA, QFN and other advanced semiconductor packages. X-ray imaging helps identify potential solder voids, bridging, insufficient solder and internal assembly defects. Equipped with a sealed microfocus X-ray source, adjustable platform tilt and high-definition imaging, the system provides detailed views of complex solder joint structures. X-ray inspection complements AOI and electrical testing, helping improve defect detection and manufacturing quality for high-density PCBAs, prototype validation and repeat production.
08The 3D Solder Paste Inspection (SPI) System is used in JETFGO's SMT production lines to inspect solder paste deposits after stencil printing and before component placement. Using three-dimensional measurement technology, the equipment evaluates solder paste volume, area, height, positional offset and shape to identify printing defects. The system supports inspection requirements for fine-pitch PCB assemblies, including solder paste patterns for 01005-size components. By detecting insufficient or excessive solder paste, printing misalignment and bridging early in the SMT process, SPI helps reduce soldering defects, improve process consistency and support reliable PCBA manufacturing. SPI inspection provides an important quality control step between solder paste printing and automated component placement.
Published test coverage and process-control checkpoints across production.
Choose your nominated forwarder or ask JETFGO to coordinate shipment. The confirmed carrier, Incoterm, insurance, charges and customs responsibilities are recorded in the quotation or proforma invoice before dispatch.
Send the forwarder name, warehouse address, account number and booking instructions. We prepare the packing list, commercial documents and handover details required by the confirmed shipping term.
We can request suitable express, air-cargo, sea-freight or other available routes based on destination, shipment size, urgency and customs requirements. Freight cost and responsibility are confirmed before shipment.
Express, air, sea or another agreed service according to destination and shipment profile.
Customer-nominated account or a route coordinated by JETFGO.
The selected Incoterm and each party’s responsibilities appear on the commercial document.
Packing list, invoice and available origin or compliance documents are prepared as agreed.
Bank transfer is commonly used for international PCB and PCBA orders. Card, digital-wallet and trade-finance options may be arranged when available for the customer, currency, region and order. Final payment instructions come only from an official JETFGO quotation or proforma invoice.
희망 날짜, 방문 인원, 확인할 생산·품질 영역을 알려주시면 담당자가 일정과 방문 계획을 확정합니다.
설계 검토와 공급업체 평가를 위한 회사, 기술, 설비 및 인증 자료입니다.
Gerber 또는 ODB++, 적층, 재료, 수량, 목표 일정과 검사 요구를 보내주시면 기술 검토 후 견적합니다.
