6층 리지드 플렉스 PCB

A 6-layer rigid-flex PCB combines rigid PCB regions and flexible interconnect sections within one integrated circuit structure. It can reduce connectors and cable assemblies while supporting compact packaging and controlled flex routing.

Send Gerber or ODB++, drill files, proposed rigid-flex stack-up, fabrication drawing, quantity, target delivery date and any bend, flex-zone, via, coverlay, stiffener or IPC-class requirements.

Yes. Once the rigid-flex stack-up, materials, via structure, bend requirements and manufacturing conditions are confirmed, the approved engineering record can support prototype validation and repeat production.

A flexible PCB primarily uses flexible circuit construction, while a rigid-flex PCB permanently combines rigid PCB sections and flexible interconnect sections within the same integrated board structure.

Rigid-flex construction can reduce connectors, cables and separate interconnect assemblies while improving packaging efficiency. Final benefits depend on the mechanical, electrical and assembly requirements of the product.

Yes. Blind and laser-drilled microvias can be evaluated for rigid-flex designs when higher routing density is required. Final feasibility depends on the layer structure, via location, transition regions and complete manufacturing stack-up.

JETFGO can review rigid-flex projects requiring IPC Class 2 or Class 3 workmanship. Final process controls, inspection requirements and qualification conditions are confirmed according to the complete project specification.

The transition area should be reviewed for copper routing, dielectric changes, coverlay, bend location, via placement, mechanical stress and component clearance to reduce reliability risks during assembly and use.