턴키 PCBA 및 박스 빌드

Turnkey PCBA combines PCB fabrication, component sourcing, SMT and through-hole assembly, inspection and testing within one coordinated manufacturing workflow. Box build extends the process into final mechanical assembly, wiring, enclosure integration, labeling and other customer-defined final assembly steps.

Send Gerber or ODB++, BOM with manufacturer part numbers, AVL or alternates policy, pick-and-place data when available, assembly drawings, test requirements, quantity and target delivery date.

Yes. Once the PCB revision, BOM, sourcing model, assembly data and test requirements are confirmed, the approved engineering record can support prototype, NPI and controlled repeat production.

Turnkey sourcing means JETFGO coordinates component procurement for the BOM. Consigned sourcing means the customer supplies the required components. Hybrid sourcing combines both models, with selected parts supplied by the customer and the remaining components sourced by JETFGO.

Yes. BOM sourcing can be reviewed against customer-approved vendors, manufacturer part numbers and alternate-component policies. Any proposed substitution should be confirmed according to the customer’s approval requirements.

Box-build scope can include finished PCBA integration, mechanical assembly, wiring, enclosure installation, labeling, testing and packaging according to the customer’s drawings and assembly instructions.

Component traceability may include manufacturer part numbers, date codes, sourcing records, approved alternates and production-lot information according to the project requirements.

Yes. Inspection and test stages can be integrated before or during final assembly according to the project requirements. The exact test method, fixture, program and acceptance criteria should be defined during engineering review.

Yes. Conformal coating can be reviewed as part of the assembly route when required. Coating material, masking areas, coverage and inspection criteria should be defined in the manufacturing documentation.