Solutions
Code solutionFLEX-MLCapacité vérifiée

PCB flexible multicouche

Construction polyimide pour interconnexions compactes, mobiles ou contraintes.

PCB flexible multicouche
JETFGO / FLEX-MLFLEX
01 / RÉPONSE TECHNIQUE

Réponse technique

Construction polyimide pour interconnexions compactes, mobiles ou contraintes. Fenêtre de procédé vérifiée: Flex layers: Up to 12 layers; Flex thickness: 0.1–1.0 mm; Flex materials: SHENGYI · Pyralux® KP · Panasonic Fichiers pour la revue: Gerber ou ODB++, perçage, empilage, plan de fabrication, quantité et date cible. Les limites publiées proviennent de la matrice de capacités JETFGO. La faisabilité finale exige le dossier complet.

Les limites publiées proviennent de la matrice de capacités JETFGO. La faisabilité finale exige le dossier complet.
02 / DATA

Fenêtre de procédé vérifiée

Construction polyimide pour interconnexions compactes, mobiles ou contraintes.

01

Flex Layer Capability

Up to 12 layers

Capacité vérifiée
02

Flex Thickness Range

0.1–1.0 mm

Capacité vérifiée
03

Flex Material Options

SHENGYI · Pyralux® KP · Panasonic

Capacité vérifiée
04

Flex Application

Static or dynamic use, subject to project review

Capacité vérifiée
05

Flex-Zone Review

Bend area · routing direction · coverlay · stiffener

Capacité vérifiée
06

Engineering Review

Stack-up · copper structure · bend requirements · assembly interface

Capacité vérifiée
05 / INPUT

Fichiers pour la revue

Flex PCB Engineering Package

Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date and any defined bend, flex-zone, coverlay or stiffener requirements.

Flex Stack-up Requirements

Provide the proposed layer structure, flex thickness, copper weights, polyimide material requirements and any adhesive or coverlay specifications when available.

Bend & Flex-Zone Requirements

Identify static or dynamic use, bend locations, available bend radius, movement direction and any restricted component or plated-feature areas.

Stiffener & Assembly Requirements

Provide stiffener locations, connector or component areas, assembly interfaces and any thickness requirements at reinforced sections.

Demander un devis
06 / FAQ

Questions techniques

Les limites publiées proviennent de la matrice de capacités JETFGO. La faisabilité finale exige le dossier complet.

01What is a multilayer flexible PCB?+

A multilayer flexible PCB contains multiple conductive layers within a flexible polyimide-based structure, providing greater routing density while allowing the circuit to bend, fold or fit into compact assemblies.

02Which files help JETFGO review a multilayer flex PCB fastest?+

Send Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date and any defined bend, flex-zone, coverlay, stiffener or assembly requirements.

03Can JETFGO support prototypes and repeat production for multilayer flexible PCBs?+

Yes. Once the flex stack-up, materials, bend requirements and manufacturing conditions are confirmed, the approved engineering record can support prototype validation and repeat production under the same process conditions.

04What is the difference between a flexible PCB and a rigid-flex PCB?+

A flexible PCB uses flexible circuit construction throughout the relevant board area, while a rigid-flex PCB permanently combines rigid PCB sections and flexible interconnect sections within one integrated structure.

05Can multilayer flexible PCBs be used for dynamic bending?+

They can be evaluated for dynamic-flex applications, but final suitability depends on the flex stack-up, copper construction, bend radius, conductor routing, flex length and required movement cycle.

06What information is needed to define a flex PCB bend area?+

Provide the bend location, available bend radius, static or dynamic use, movement direction, flex-zone length and any restrictions on components, vias or plated features in the bending area.

07What are stiffeners used for on a flexible PCB?+

Stiffeners reinforce selected flex PCB areas such as connectors, component locations or assembly interfaces where additional mechanical support or controlled thickness is required.

08Does a higher flex layer count affect bending performance?+

Yes. Increasing the number of conductive and dielectric layers generally increases the mechanical complexity of the flex structure, so bend performance must be reviewed together with total thickness, copper construction and intended movement.

RFQ / DFM

Envoyez le besoin. Recevez un plan d’approvisionnement fabricable.

Envoyez Gerber ou ODB++, empilage, matériaux, quantité, date cible et tests pour étude et devis technique.

Revue techniqueMatériaux et empilageFabrication précise