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Code solutionMCPCB-ALCapacité vérifiée

PCB LED à noyau aluminium

Voie métal-core lorsque le transfert thermique guide la conception.

PCB LED à noyau aluminium
JETFGO / MCPCB-ALMETAL-CORE
01 / RÉPONSE TECHNIQUE

Réponse technique

Voie métal-core lorsque le transfert thermique guide la conception. Fenêtre de procédé vérifiée: Material family: Metal core: BOYU; Rigid thickness: 0.3–8.0 mm; Routing: Routing · punching · V-cut · beveling Fichiers pour la revue: Gerber ou ODB++, perçage, empilage, plan de fabrication, quantité et date cible. Les limites publiées proviennent de la matrice de capacités JETFGO. La faisabilité finale exige le dossier complet.

Les limites publiées proviennent de la matrice de capacités JETFGO. La faisabilité finale exige le dossier complet.
02 / DATA

Fenêtre de procédé vérifiée

Voie métal-core lorsque le transfert thermique guide la conception.

01

Aluminum-Core Material

BOYU aluminum-base laminate

Capacité vérifiée
02

PCB Thickness Range

0.3–8.0 mm

Capacité vérifiée
03

Profiling Options

Routing · punching · V-cut · beveling

Capacité vérifiée
04

Thermal-Path Review

Aluminum core · dielectric layer · copper · LED heat path

Capacité vérifiée
05

LED Application Review

Thermal pads · component heat zones · mounting · board outline

Capacité vérifiée
06

Engineering Review

Material · dielectric · thickness · thermal · mechanical requirements

Capacité vérifiée
05 / INPUT

Fichiers pour la revue

Aluminum PCB Engineering Package

Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date and any aluminum-core, thermal, dielectric or mechanical requirements.

Thermal Requirements

Provide heat-source locations, thermal-management requirements and any specified dielectric thermal performance or aluminum-core material requirements.

Material & Stack-up Requirements

Provide aluminum-core material, board thickness, copper requirements, dielectric structure and any approved material or construction restrictions.

Mechanical & Profiling Requirements

Provide final board outline, mounting holes and any routing, punching, V-cut, beveling or mechanical tolerance requirements.

LED Assembly Requirements

Identify LED locations, thermal-pad areas, component mounting interfaces and any assembly constraints that may affect heat transfer or board construction.

Demander un devis
06 / FAQ

Questions techniques

Les limites publiées proviennent de la matrice de capacités JETFGO. La faisabilité finale exige le dossier complet.

01What is an aluminum-core LED PCB?+

An aluminum-core LED PCB is a metal-base circuit board that uses an aluminum base, dielectric layer and copper circuitry to transfer heat away from LEDs and other heat-generating components more efficiently than a conventional PCB construction.

02Which files help JETFGO review an aluminum-core LED PCB fastest?+

Send Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date and any aluminum-core, thermal, dielectric, copper or mechanical requirements.

03Can JETFGO support prototypes and repeat production for aluminum LED PCBs?+

Yes. Once the aluminum-core material, dielectric structure, copper requirements, thickness and mechanical construction are confirmed, the approved engineering record can support prototype validation and repeat production.

04Why is aluminum used for LED PCBs?+

Aluminum provides a metal base that helps transfer heat away from LEDs through the dielectric and copper structure into the surrounding thermal assembly. This makes it useful for lighting and other heat-intensive electronics.

05What is the difference between an aluminum PCB and an FR-4 PCB?+

An aluminum PCB includes a metal base designed to support heat transfer, while a conventional FR-4 PCB uses a fiberglass-reinforced laminate structure. Material selection depends on thermal, electrical, mechanical and cost requirements.

06Does the aluminum core alone determine LED PCB thermal performance?+

No. Thermal performance also depends on the dielectric layer, copper structure, component thermal pads, board thickness, heat-source layout and the thermal connection between the PCB and final assembly.

07Which profiling methods are available for aluminum-core PCBs?+

JETFGO can review aluminum-core PCB projects requiring routing, punching, V-cut or beveling. Final profiling method depends on board thickness, outline, panel structure and mechanical requirements.

08Can aluminum-core PCBs be used for high-power LEDs?+

Yes, aluminum-core PCBs are commonly evaluated for high-power LED applications where heat transfer is a major design requirement. Final suitability depends on LED power, dielectric performance, copper design, board structure and the complete thermal path.

RFQ / DFM

Envoyez le besoin. Recevez un plan d’approvisionnement fabricable.

Envoyez Gerber ou ODB++, empilage, matériaux, quantité, date cible et tests pour étude et devis technique.

Revue techniqueMatériaux et empilageFabrication précise