Soluzioni
Codice soluzioneMCPCB-ALCapacità verificata

PCB LED con nucleo in alluminio

Percorso metal-core quando trasferimento termico e costruzione guidano il progetto.

PCB LED con nucleo in alluminio
JETFGO / MCPCB-ALMETAL-CORE
01 / RISPOSTA TECNICA

Risposta tecnica

Percorso metal-core quando trasferimento termico e costruzione guidano il progetto. Finestra di processo verificata: Material family: Metal core: BOYU; Rigid thickness: 0.3–8.0 mm; Routing: Routing · punching · V-cut · beveling File per la revisione: Gerber o ODB++, file di foratura, stack-up, disegno, quantità e data richiesta. I limiti pubblicati derivano dall’attuale tabella capacità JETFGO; la fattibilità finale richiede i dati completi.

I limiti pubblicati derivano dall’attuale tabella capacità JETFGO; la fattibilità finale richiede i dati completi.
02 / DATA

Finestra di processo verificata

Percorso metal-core quando trasferimento termico e costruzione guidano il progetto.

01

Aluminum-Core Material

BOYU aluminum-base laminate

Capacità verificata
02

PCB Thickness Range

0.3–8.0 mm

Capacità verificata
03

Profiling Options

Routing · punching · V-cut · beveling

Capacità verificata
04

Thermal-Path Review

Aluminum core · dielectric layer · copper · LED heat path

Capacità verificata
05

LED Application Review

Thermal pads · component heat zones · mounting · board outline

Capacità verificata
06

Engineering Review

Material · dielectric · thickness · thermal · mechanical requirements

Capacità verificata
05 / INPUT

File per la revisione

Aluminum PCB Engineering Package

Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date and any aluminum-core, thermal, dielectric or mechanical requirements.

Thermal Requirements

Provide heat-source locations, thermal-management requirements and any specified dielectric thermal performance or aluminum-core material requirements.

Material & Stack-up Requirements

Provide aluminum-core material, board thickness, copper requirements, dielectric structure and any approved material or construction restrictions.

Mechanical & Profiling Requirements

Provide final board outline, mounting holes and any routing, punching, V-cut, beveling or mechanical tolerance requirements.

LED Assembly Requirements

Identify LED locations, thermal-pad areas, component mounting interfaces and any assembly constraints that may affect heat transfer or board construction.

Richiedi un preventivo
06 / FAQ

Domande tecniche

I limiti pubblicati derivano dall’attuale tabella capacità JETFGO; la fattibilità finale richiede i dati completi.

01What is an aluminum-core LED PCB?+

An aluminum-core LED PCB is a metal-base circuit board that uses an aluminum base, dielectric layer and copper circuitry to transfer heat away from LEDs and other heat-generating components more efficiently than a conventional PCB construction.

02Which files help JETFGO review an aluminum-core LED PCB fastest?+

Send Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date and any aluminum-core, thermal, dielectric, copper or mechanical requirements.

03Can JETFGO support prototypes and repeat production for aluminum LED PCBs?+

Yes. Once the aluminum-core material, dielectric structure, copper requirements, thickness and mechanical construction are confirmed, the approved engineering record can support prototype validation and repeat production.

04Why is aluminum used for LED PCBs?+

Aluminum provides a metal base that helps transfer heat away from LEDs through the dielectric and copper structure into the surrounding thermal assembly. This makes it useful for lighting and other heat-intensive electronics.

05What is the difference between an aluminum PCB and an FR-4 PCB?+

An aluminum PCB includes a metal base designed to support heat transfer, while a conventional FR-4 PCB uses a fiberglass-reinforced laminate structure. Material selection depends on thermal, electrical, mechanical and cost requirements.

06Does the aluminum core alone determine LED PCB thermal performance?+

No. Thermal performance also depends on the dielectric layer, copper structure, component thermal pads, board thickness, heat-source layout and the thermal connection between the PCB and final assembly.

07Which profiling methods are available for aluminum-core PCBs?+

JETFGO can review aluminum-core PCB projects requiring routing, punching, V-cut or beveling. Final profiling method depends on board thickness, outline, panel structure and mechanical requirements.

08Can aluminum-core PCBs be used for high-power LEDs?+

Yes, aluminum-core PCBs are commonly evaluated for high-power LED applications where heat transfer is a major design requirement. Final suitability depends on LED power, dielectric performance, copper design, board structure and the complete thermal path.

RFQ / DFM

Invia il requisito. Ricevi un piano di fornitura producibile.

Invia Gerber o ODB++, stackup, materiali, quantità, data richiesta e test per la verifica tecnica e il preventivo.

Revisione tecnicaMateriali e stack-upFabbricazione