الحلول
رمز الحلMCPCB-ALقدرة موثقة

PCB LED بقلب ألمنيوم

مسار بقلب معدني عندما يكون نقل الحرارة والبناء الميكانيكي أساس التصميم.

PCB LED بقلب ألمنيوم
JETFGO / MCPCB-ALMETAL-CORE
01 / الإجابة الهندسية

الإجابة الهندسية

مسار بقلب معدني عندما يكون نقل الحرارة والبناء الميكانيكي أساس التصميم. نطاق العملية الموثق: Material family: Metal core: BOYU; Rigid thickness: 0.3–8.0 mm; Routing: Routing · punching · V-cut · beveling ملفات المراجعة: Gerber أو ODB++ وملفات الحفر وبنية الطبقات والرسم والكمية والموعد المطلوب. الحدود المنشورة مأخوذة من جدول قدرات JETFGO الحالي، وتتطلب الجدوى النهائية حزمة بيانات كاملة.

الحدود المنشورة مأخوذة من جدول قدرات JETFGO الحالي، وتتطلب الجدوى النهائية حزمة بيانات كاملة.
02 / DATA

نطاق العملية الموثق

مسار بقلب معدني عندما يكون نقل الحرارة والبناء الميكانيكي أساس التصميم.

01

Aluminum-Core Material

BOYU aluminum-base laminate

قدرة موثقة
02

PCB Thickness Range

0.3–8.0 mm

قدرة موثقة
03

Profiling Options

Routing · punching · V-cut · beveling

قدرة موثقة
04

Thermal-Path Review

Aluminum core · dielectric layer · copper · LED heat path

قدرة موثقة
05

LED Application Review

Thermal pads · component heat zones · mounting · board outline

قدرة موثقة
06

Engineering Review

Material · dielectric · thickness · thermal · mechanical requirements

قدرة موثقة
05 / INPUT

ملفات المراجعة

Aluminum PCB Engineering Package

Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date and any aluminum-core, thermal, dielectric or mechanical requirements.

Thermal Requirements

Provide heat-source locations, thermal-management requirements and any specified dielectric thermal performance or aluminum-core material requirements.

Material & Stack-up Requirements

Provide aluminum-core material, board thickness, copper requirements, dielectric structure and any approved material or construction restrictions.

Mechanical & Profiling Requirements

Provide final board outline, mounting holes and any routing, punching, V-cut, beveling or mechanical tolerance requirements.

LED Assembly Requirements

Identify LED locations, thermal-pad areas, component mounting interfaces and any assembly constraints that may affect heat transfer or board construction.

اطلب عرض سعر
06 / FAQ

أسئلة تقنية

الحدود المنشورة مأخوذة من جدول قدرات JETFGO الحالي، وتتطلب الجدوى النهائية حزمة بيانات كاملة.

01What is an aluminum-core LED PCB?+

An aluminum-core LED PCB is a metal-base circuit board that uses an aluminum base, dielectric layer and copper circuitry to transfer heat away from LEDs and other heat-generating components more efficiently than a conventional PCB construction.

02Which files help JETFGO review an aluminum-core LED PCB fastest?+

Send Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date and any aluminum-core, thermal, dielectric, copper or mechanical requirements.

03Can JETFGO support prototypes and repeat production for aluminum LED PCBs?+

Yes. Once the aluminum-core material, dielectric structure, copper requirements, thickness and mechanical construction are confirmed, the approved engineering record can support prototype validation and repeat production.

04Why is aluminum used for LED PCBs?+

Aluminum provides a metal base that helps transfer heat away from LEDs through the dielectric and copper structure into the surrounding thermal assembly. This makes it useful for lighting and other heat-intensive electronics.

05What is the difference between an aluminum PCB and an FR-4 PCB?+

An aluminum PCB includes a metal base designed to support heat transfer, while a conventional FR-4 PCB uses a fiberglass-reinforced laminate structure. Material selection depends on thermal, electrical, mechanical and cost requirements.

06Does the aluminum core alone determine LED PCB thermal performance?+

No. Thermal performance also depends on the dielectric layer, copper structure, component thermal pads, board thickness, heat-source layout and the thermal connection between the PCB and final assembly.

07Which profiling methods are available for aluminum-core PCBs?+

JETFGO can review aluminum-core PCB projects requiring routing, punching, V-cut or beveling. Final profiling method depends on board thickness, outline, panel structure and mechanical requirements.

08Can aluminum-core PCBs be used for high-power LEDs?+

Yes, aluminum-core PCBs are commonly evaluated for high-power LED applications where heat transfer is a major design requirement. Final suitability depends on LED power, dielectric performance, copper design, board structure and the complete thermal path.

RFQ / DFM

أرسل المتطلبات واحصل على خطة توريد قابلة للتنفيذ.

أرسل Gerber أو ODB++ والطبقات والمواد والكمية والموعد والاختبارات لمراجعة القابلية وتقديم عرض فني.

مراجعة هندسيةالمواد والبنيةتصنيع دقيق