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アルミコアLED PCB

熱伝導と構造条件が重要なLED・電源基板向け。

アルミコアLED PCB
JETFGO / MCPCB-ALMETAL-CORE
01 / 技術回答

技術回答

熱伝導と構造条件が重要なLED・電源基板向け。 確認済み工程範囲: Material family: Metal core: BOYU; Rigid thickness: 0.3–8.0 mm; Routing: Routing · punching · V-cut · beveling レビュー用資料: GerberまたはODB++、ドリルデータ、層構成、製造図、数量、希望納期。 掲載値はJETFGOの現行工程能力表に基づきます。最終可否は完全な設計資料で確認します。

掲載値はJETFGOの現行工程能力表に基づきます。最終可否は完全な設計資料で確認します。
02 / DATA

確認済み工程範囲

熱伝導と構造条件が重要なLED・電源基板向け。

01

Aluminum-Core Material

BOYU aluminum-base laminate

能力表で確認
02

PCB Thickness Range

0.3–8.0 mm

能力表で確認
03

Profiling Options

Routing · punching · V-cut · beveling

能力表で確認
04

Thermal-Path Review

Aluminum core · dielectric layer · copper · LED heat path

能力表で確認
05

LED Application Review

Thermal pads · component heat zones · mounting · board outline

能力表で確認
06

Engineering Review

Material · dielectric · thickness · thermal · mechanical requirements

能力表で確認
05 / INPUT

レビュー用資料

Aluminum PCB Engineering Package

Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date and any aluminum-core, thermal, dielectric or mechanical requirements.

Thermal Requirements

Provide heat-source locations, thermal-management requirements and any specified dielectric thermal performance or aluminum-core material requirements.

Material & Stack-up Requirements

Provide aluminum-core material, board thickness, copper requirements, dielectric structure and any approved material or construction restrictions.

Mechanical & Profiling Requirements

Provide final board outline, mounting holes and any routing, punching, V-cut, beveling or mechanical tolerance requirements.

LED Assembly Requirements

Identify LED locations, thermal-pad areas, component mounting interfaces and any assembly constraints that may affect heat transfer or board construction.

見積もり依頼
06 / FAQ

技術FAQ

掲載値はJETFGOの現行工程能力表に基づきます。最終可否は完全な設計資料で確認します。

01What is an aluminum-core LED PCB?+

An aluminum-core LED PCB is a metal-base circuit board that uses an aluminum base, dielectric layer and copper circuitry to transfer heat away from LEDs and other heat-generating components more efficiently than a conventional PCB construction.

02Which files help JETFGO review an aluminum-core LED PCB fastest?+

Send Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date and any aluminum-core, thermal, dielectric, copper or mechanical requirements.

03Can JETFGO support prototypes and repeat production for aluminum LED PCBs?+

Yes. Once the aluminum-core material, dielectric structure, copper requirements, thickness and mechanical construction are confirmed, the approved engineering record can support prototype validation and repeat production.

04Why is aluminum used for LED PCBs?+

Aluminum provides a metal base that helps transfer heat away from LEDs through the dielectric and copper structure into the surrounding thermal assembly. This makes it useful for lighting and other heat-intensive electronics.

05What is the difference between an aluminum PCB and an FR-4 PCB?+

An aluminum PCB includes a metal base designed to support heat transfer, while a conventional FR-4 PCB uses a fiberglass-reinforced laminate structure. Material selection depends on thermal, electrical, mechanical and cost requirements.

06Does the aluminum core alone determine LED PCB thermal performance?+

No. Thermal performance also depends on the dielectric layer, copper structure, component thermal pads, board thickness, heat-source layout and the thermal connection between the PCB and final assembly.

07Which profiling methods are available for aluminum-core PCBs?+

JETFGO can review aluminum-core PCB projects requiring routing, punching, V-cut or beveling. Final profiling method depends on board thickness, outline, panel structure and mechanical requirements.

08Can aluminum-core PCBs be used for high-power LEDs?+

Yes, aluminum-core PCBs are commonly evaluated for high-power LED applications where heat transfer is a major design requirement. Final suitability depends on LED power, dielectric performance, copper design, board structure and the complete thermal path.

RFQ / DFM

要件を送り、実行可能な供給計画を受け取る。

Gerber または ODB++、積層、材料、数量、希望納期、検査要件をお送りください。技術確認後に見積します。

技術レビュー材料・層構成精密製造