6層高速PCB

No. ±8% is a published capability reference for this solution. Final impedance feasibility depends on the complete stack-up, materials, dielectric structure, copper thickness, trace geometry and target impedance confirmed during engineering review.

Send Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date and any controlled-impedance or back-drill requirements.

Yes. Once the stack-up, materials, impedance requirements and back-drill conditions are confirmed, the approved engineering record can support prototype validation and repeat production under the same manufacturing conditions.

The stack-up defines the relationship between signal layers, reference planes, dielectric thickness and copper geometry. These factors directly affect controlled impedance, return-current paths and high-speed signal integrity.

Back drilling may be considered when unused plated-through-hole stubs could affect high-speed signal integrity. Final need and drill depth depend on the signal requirements, stack-up, via transitions and acceptable residual stub.

A via stub is the unused conductive portion of a plated through-hole beyond the signal connection layer. At high data rates, it can contribute to reflections and impedance discontinuities, so selected vias may require back drilling.

Yes. A 6-layer PCB can support single-ended and differential controlled-impedance signals when the stack-up, routing layers, reference planes and trace geometry are designed appropriately and confirmed during engineering review.