Stack-up-, Referenzlagen- und Backdrill-Prüfung für datenintensive Baugruppen. Bestätigtes Prozessfenster: Impedance tolerance: ±8%; Back drilling: Any-layer capability; Mechanical aspect ratio: Up to 20:1 Daten für die Prüfung: Gerber oder ODB++, Bohrdaten, Stack-up, Fertigungszeichnung, Menge und Zieltermin. Die veröffentlichten Grenzen stammen aus der aktuellen JETFGO-Fähigkeitsmatrix. Die endgültige Machbarkeit erfordert vollständige Daten.
Die veröffentlichten Grenzen stammen aus der aktuellen JETFGO-Fähigkeitsmatrix. Die endgültige Machbarkeit erfordert vollständige Daten.LösungscodeHS-06LFähigkeit belegt
6-Lagen-High-Speed-PCB
Stack-up-, Referenzlagen- und Backdrill-Prüfung für datenintensive Baugruppen.
JETFGO / HS-06LRIGID
01 / TECHNISCHE ANTWORT
Technische Antwort
02 / DATA
Bestätigtes Prozessfenster
Stack-up-, Referenzlagen- und Backdrill-Prüfung für datenintensive Baugruppen.
Impedance Tolerance
±8%
Back Drilling
Target-layer and depth review based on stack-up
Mechanical Aspect Ratio
Up to 20:1
High-Speed Stack-up
Reference-plane and controlled-impedance review
Back-Drill Review
Drill side · target layer · residual stub · depth
05 / INPUT
Daten für die Prüfung
High-Speed PCB Engineering Package
Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date and applicable controlled-impedance or back-drill requirements.
Controlled-Impedance Requirements
Provide target impedance, tolerance, routing layer, reference plane and applicable single-ended or differential signal classes.
Back-Drill Requirements
Provide the required drill side, target layer, residual stub requirement and any project-specific back-drill depth or tolerance information.
High-Speed Stack-up
Angebot anfordernProvide the proposed layer order, signal layers, reference planes, board thickness, copper requirements and material preferences when available.
06 / FAQ
Technische Fragen
Die veröffentlichten Grenzen stammen aus der aktuellen JETFGO-Fähigkeitsmatrix. Die endgültige Machbarkeit erfordert vollständige Daten.
01Is ±8% impedance tolerance guaranteed for every 6-layer high-speed PCB?+
No. ±8% is a published capability reference for this solution. Final impedance feasibility depends on the complete stack-up, materials, dielectric structure, copper thickness, trace geometry and target impedance confirmed during engineering review.
02Which files help JETFGO review a 6-layer high-speed PCB fastest?+
Send Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date and any controlled-impedance or back-drill requirements.
03Can JETFGO support prototypes and repeat production for 6-layer high-speed PCBs?+
Yes. Once the stack-up, materials, impedance requirements and back-drill conditions are confirmed, the approved engineering record can support prototype validation and repeat production under the same manufacturing conditions.
04Why is stack-up important for a 6-layer high-speed PCB?+
The stack-up defines the relationship between signal layers, reference planes, dielectric thickness and copper geometry. These factors directly affect controlled impedance, return-current paths and high-speed signal integrity.
05When is back drilling needed on a high-speed PCB?+
Back drilling may be considered when unused plated-through-hole stubs could affect high-speed signal integrity. Final need and drill depth depend on the signal requirements, stack-up, via transitions and acceptable residual stub.
06What is a via stub in a high-speed PCB?+
A via stub is the unused conductive portion of a plated through-hole beyond the signal connection layer. At high data rates, it can contribute to reflections and impedance discontinuities, so selected vias may require back drilling.
07Can a 6-layer PCB support both single-ended and differential impedance?+
Yes. A 6-layer PCB can support single-ended and differential controlled-impedance signals when the stack-up, routing layers, reference planes and trace geometry are designed appropriately and confirmed during engineering review.
RFQ / DFM
Anforderung senden. Einen fertigbaren Lieferplan erhalten.
Senden Sie Gerber oder ODB++, Aufbau, Material, Menge, Zieltermin und Prüfanforderungen für Machbarkeitsprüfung und Angebot.
Engineering-PrüfungMaterial & Stack-upPräzisionsfertigung