Praxisgerechter Stack-up für definierte Single-Ended- oder Differenzimpedanz. Bestätigtes Prozessfenster: Impedance tolerance: ±8%; Line / spacing example: Minimum 3 / 2.5 mil; Materials: TG135–TG180 FR-4 options Daten für die Prüfung: Gerber oder ODB++, Bohrdaten, Stack-up, Fertigungszeichnung, Menge und Zieltermin. Die veröffentlichten Grenzen stammen aus der aktuellen JETFGO-Fähigkeitsmatrix. Die endgültige Machbarkeit erfordert vollständige Daten.
Die veröffentlichten Grenzen stammen aus der aktuellen JETFGO-Fähigkeitsmatrix. Die endgültige Machbarkeit erfordert vollständige Daten.LösungscodeSI-04LFähigkeit belegt
4-Lagen-PCB mit kontrollierter Impedanz
Praxisgerechter Stack-up für definierte Single-Ended- oder Differenzimpedanz.
JETFGO / SI-04LRIGID
01 / TECHNISCHE ANTWORT
Technische Antwort
02 / DATA
Bestätigtes Prozessfenster
Praxisgerechter Stack-up für definierte Single-Ended- oder Differenzimpedanz.
Impedance Tolerance
±8%
Minimum Line / Space
3 / 2.5 mil
FR-4 Material Options
Tg135–Tg180 FR-4
Impedance Types
Single-ended · differential
Stack-up Review
Routing layer · reference plane · dielectric · copper geometry
05 / INPUT
Daten für die Prüfung
Controlled-Impedance Engineering Package
Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date and applicable controlled-impedance requirements.
Impedance Requirement Table
For each controlled signal class, provide the target impedance, tolerance, routing layer, reference plane and whether manufacturer trace-width adjustment is permitted.
Stack-up & Material Requirements
Angebot anfordernProvide the preferred layer structure, board thickness, copper weight, FR-4 Tg or material preference and any dielectric requirements related to impedance control.
06 / FAQ
Technische Fragen
Die veröffentlichten Grenzen stammen aus der aktuellen JETFGO-Fähigkeitsmatrix. Die endgültige Machbarkeit erfordert vollständige Daten.
01Is ±8% impedance tolerance guaranteed for every 4-layer PCB?+
No. ±8% is a published capability reference for this solution. Final feasibility depends on the complete stack-up, materials, copper thickness, trace geometry, target impedance and other project requirements confirmed during engineering review.
02Which files help JETFGO review a 4-layer controlled impedance PCB fastest?+
Send Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date and an impedance requirement table showing target values, tolerances, routing layers and reference planes.
03Can JETFGO support prototypes and repeat production for controlled impedance PCBs?+
Yes. Once the stack-up, materials and impedance requirements are confirmed, the approved engineering record can support prototype validation and repeat production under the same manufacturing conditions.
04What information is required for controlled impedance PCB manufacturing?+
For each controlled signal class, provide the target impedance, tolerance, routing layer and reference plane. The proposed stack-up, board thickness, copper requirements and material preference should also be included when available.
05Can a 4-layer PCB support both single-ended and differential impedance?+
Yes, when the stack-up, reference planes, dielectric structure and trace geometry are designed appropriately. Final manufacturability is confirmed after reviewing the complete PCB data and impedance requirements.
06Why is the reference plane important for controlled impedance?+
A continuous reference plane provides a defined return path and forms part of the transmission-line geometry that determines impedance. Plane gaps or changes can create impedance discontinuities and affect signal integrity.
RFQ / DFM
Anforderung senden. Einen fertigbaren Lieferplan erhalten.
Senden Sie Gerber oder ODB++, Aufbau, Material, Menge, Zieltermin und Prüfanforderungen für Machbarkeitsprüfung und Angebot.
Engineering-PrüfungMaterial & Stack-upPräzisionsfertigung