Revue empilage, plans de référence et back-drill pour cartes à haut débit. Fenêtre de procédé vérifiée: Impedance tolerance: ±8%; Back drilling: Any-layer capability; Mechanical aspect ratio: Up to 20:1 Fichiers pour la revue: Gerber ou ODB++, perçage, empilage, plan de fabrication, quantité et date cible. Les limites publiées proviennent de la matrice de capacités JETFGO. La faisabilité finale exige le dossier complet.
Les limites publiées proviennent de la matrice de capacités JETFGO. La faisabilité finale exige le dossier complet.Code solutionHS-06LCapacité vérifiée
PCB haute vitesse 6 couches
Revue empilage, plans de référence et back-drill pour cartes à haut débit.
JETFGO / HS-06LRIGID
01 / RÉPONSE TECHNIQUE
Réponse technique
02 / DATA
Fenêtre de procédé vérifiée
Revue empilage, plans de référence et back-drill pour cartes à haut débit.
Impedance Tolerance
±8%
Back Drilling
Target-layer and depth review based on stack-up
Mechanical Aspect Ratio
Up to 20:1
High-Speed Stack-up
Reference-plane and controlled-impedance review
Back-Drill Review
Drill side · target layer · residual stub · depth
05 / INPUT
Fichiers pour la revue
High-Speed PCB Engineering Package
Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date and applicable controlled-impedance or back-drill requirements.
Controlled-Impedance Requirements
Provide target impedance, tolerance, routing layer, reference plane and applicable single-ended or differential signal classes.
Back-Drill Requirements
Provide the required drill side, target layer, residual stub requirement and any project-specific back-drill depth or tolerance information.
High-Speed Stack-up
Demander un devisProvide the proposed layer order, signal layers, reference planes, board thickness, copper requirements and material preferences when available.
06 / FAQ
Questions techniques
Les limites publiées proviennent de la matrice de capacités JETFGO. La faisabilité finale exige le dossier complet.
01Is ±8% impedance tolerance guaranteed for every 6-layer high-speed PCB?+
No. ±8% is a published capability reference for this solution. Final impedance feasibility depends on the complete stack-up, materials, dielectric structure, copper thickness, trace geometry and target impedance confirmed during engineering review.
02Which files help JETFGO review a 6-layer high-speed PCB fastest?+
Send Gerber or ODB++, drill files, proposed stack-up, fabrication drawing, quantity, target delivery date and any controlled-impedance or back-drill requirements.
03Can JETFGO support prototypes and repeat production for 6-layer high-speed PCBs?+
Yes. Once the stack-up, materials, impedance requirements and back-drill conditions are confirmed, the approved engineering record can support prototype validation and repeat production under the same manufacturing conditions.
04Why is stack-up important for a 6-layer high-speed PCB?+
The stack-up defines the relationship between signal layers, reference planes, dielectric thickness and copper geometry. These factors directly affect controlled impedance, return-current paths and high-speed signal integrity.
05When is back drilling needed on a high-speed PCB?+
Back drilling may be considered when unused plated-through-hole stubs could affect high-speed signal integrity. Final need and drill depth depend on the signal requirements, stack-up, via transitions and acceptable residual stub.
06What is a via stub in a high-speed PCB?+
A via stub is the unused conductive portion of a plated through-hole beyond the signal connection layer. At high data rates, it can contribute to reflections and impedance discontinuities, so selected vias may require back drilling.
07Can a 6-layer PCB support both single-ended and differential impedance?+
Yes. A 6-layer PCB can support single-ended and differential controlled-impedance signals when the stack-up, routing layers, reference planes and trace geometry are designed appropriately and confirmed during engineering review.
RFQ / DFM
Envoyez le besoin. Recevez un plan d’approvisionnement fabricable.
Envoyez Gerber ou ODB++, empilage, matériaux, quantité, date cible et tests pour étude et devis technique.
Revue techniqueMatériaux et empilageFabrication précise