A current-carrying and thermal path for power conversion, drives and high-load industrial electronics. Verified process window: Copper capability: Rigid inner / outer: 1/3–28 oz; Line / spacing guidance: Copper-dependent process window; IPC class: Class 2 and Class 3 Files for a useful review: Gerber or ODB++, drill files, stackup, fabrication drawing, quantity and target date. Published limits are drawn from JETFGO’s current capability chart. Final feasibility depends on the complete data package and engineering review.
Published limits are drawn from JETFGO’s current capability chart. Final feasibility depends on the complete data package and engineering review.Solution codeHCP-06OZ+Capability-backed
Heavy-Copper Power PCB
A current-carrying and thermal path for power conversion, drives and high-load industrial electronics.
JETFGO / HCP-06OZ+RIGID
01 / ENGINEERING ANSWER
Engineering answer
02 / DATA
Verified process window
A current-carrying and thermal path for power conversion, drives and high-load industrial electronics.
Copper capability
Rigid inner / outer: 1/3–28 oz
Line / spacing guidance
Copper-dependent process window
IPC class
Class 2 and Class 3
05 / INPUT
Files for a useful review
Gerber or ODB++, drill files, stackup, fabrication drawing, quantity and target date.
Request a quote06 / FAQ
Technical questions
Published limits are drawn from JETFGO’s current capability chart. Final feasibility depends on the complete data package and engineering review.
01Is Heavy-Copper Power PCB automatically manufacturable?+
No. Published limits guide selection; final feasibility depends on the complete stackup, geometry, materials and acceptance criteria.
02Which files produce the fastest engineering answer?+
Gerber or ODB++, drill files, stackup, fabrication drawing, quantity and target date.
03Can JETFGO support prototype and repeat production?+
Yes. The same engineering record can support prototype review and a controlled transition to repeat production.
RFQ / DFM
Discuss your next order directly with our factory.
Send the Gerber or ODB++, stackup, material, quantity, target date and test requirements. Our team will review feasibility and return a technical quotation for the order you manage.
Engineering reviewMaterial & stackupPrecision fabrication