A density-led build path for compact layouts, fine-pitch BGAs and laser-drilled interconnects. Verified process window: Blind via: 3–5 mil; Laser drill: 3–5 mil; BGA pitch: 0.4 mm Files for a useful review: Gerber or ODB++, drill files, stackup, fabrication drawing, quantity and target date. Published limits are drawn from JETFGO’s current capability chart. Final feasibility depends on the complete data package and engineering review.
Published limits are drawn from JETFGO’s current capability chart. Final feasibility depends on the complete data package and engineering review.1+N+1 HDI Microvia PCB
A density-led build path for compact layouts, fine-pitch BGAs and laser-drilled interconnects.

Engineering answer
Verified process window
A density-led build path for compact layouts, fine-pitch BGAs and laser-drilled interconnects.
Blind via
3–5 mil
Laser drill
3–5 mil
BGA pitch
0.4 mm
Files for a useful review
Gerber or ODB++, drill files, stackup, fabrication drawing, quantity and target date.
Request a quoteTechnical questions
Published limits are drawn from JETFGO’s current capability chart. Final feasibility depends on the complete data package and engineering review.
01Is 1+N+1 HDI Microvia PCB automatically manufacturable?+
No. Published limits guide selection; final feasibility depends on the complete stackup, geometry, materials and acceptance criteria.
02Which files produce the fastest engineering answer?+
Gerber or ODB++, drill files, stackup, fabrication drawing, quantity and target date.
03Can JETFGO support prototype and repeat production?+
Yes. The same engineering record can support prototype review and a controlled transition to repeat production.
Discuss your next order directly with our factory.
Send the Gerber or ODB++, stackup, material, quantity, target date and test requirements. Our team will review feasibility and return a technical quotation for the order you manage.
