PRODUCT & PROCESS DETAILLayers2
MaterialCopper base+ST115B
Surface FinishENIG
Board Thickness3.2mm
Minimum Hole1.6mm
Line Width & Space8 / 8mil
Special TechnologyMetal Base, Thermoelectric Separation
E-mailsal@jetfgo.com
Tel0755-23300780 / 23302390
Fax0755-23302910
AddBuilding 18, District 1, Xinhe Xinxing Industrial Park, Fuhai Street, Baoan District, Shenzhen
Layers: 2
