TL;DR
For a Texas Instruments surface-mount IC labeled MSL 3, the stated floor life is 168 hours after its moisture barrier bag is opened, provided ambient conditions do not exceed 30°C and 60% relative humidity. That period runs through final reflow, so a build scheduled seven days after opening has no time buffer. Confirm the exact part label and handling record before fixing the assembly date.
What sets the seven-day limit?
Texas Instruments’ handling guidance defines floor life as the time from opening the moisture barrier bag to final reflow. Its MSL 3 entry specifies 168 hours at no more than 30°C and 60% relative humidity. The rating and peak reflow temperature must be checked for the actual orderable part; the MSL 3 limit should not be applied to every component on a BOM.
Why does this affect the build date?
Placing an IC on the board before the 168-hour limit does not complete the requirement: final reflow must occur within the applicable floor life. TI says that if floor life is exceeded, or the humidity indicator card shows excessive moisture, the affected parts require drying before reflow. The recovery conditions depend on the package and handling materials, so buyers should not assume a fixed baking time or an unchanged assembly schedule.
What should the buyer confirm?
Before sending customer-consigned ICs, provide the exact part number, moisture-sensitivity label, bag seal and opening times, and any humidity indicator and storage records. Ask the assembler to confirm when final reflow is planned and how an exceeded limit would be handled for that package. If the records are incomplete, resolve the handling plan before committing to a PCBA delivery date.
JETFGO’s English pages describe customer-consigned component supply and SMT assembly. They do not publish a specific moisture-control or baking capability, so handling for a particular shipment needs project-specific confirmation.
References
Texas Instruments, AN-2029 Handling & Process Recommendations, revised June 2020: https://www.ti.com/lit/an/snoa550h/snoa550h.pdf
Related JETFGO pages
PCB Assembly & PCBA Manufacturing Services: https://jetfgo.online/en/products/pcb-assembly Electronic Component Sourcing Services: https://jetfgo.online/en/products/component-sourcing