01 / 03Six layers. Heavy copper.
- Layers
- 6
- Thickness
- 3.00 mm
- Finished copper
- 6 oz
- Minimum hole
- 0.35 mm
- Material
- Shengyi S1000-2M
- Surface finish
- Immersion gold
Notable process6/6 oz inner- and outer-layer core lamination
Aplicaciones
Aeroespacial y defensa
RF, rigid-flex y soporte de ciclo de vida para electrónica crítica.
Cotizar directamente con fábricaJETFGO / Aeroespacial y defensa
PRODUCT & PROCESS DETAIL
PRODUCT & PROCESS DETAIL
DRONE PCB / PRODUCTION EXAMPLES
Three real boards. Three different builds.
Explore documented drone PCB builds from our production records. The photographs and specifications below belong to the individual boards shown, rather than a generic capability claim.
DRONE APPLICATION VISUAL01 / 03
02 / 03Twelve layers. Blind vias.
- Layers
- 12
- Thickness
- 2.94 mm
- Finished copper
- 2/2 oz
- Minimum hole
- 0.35 mm
- Material
- Shengyi S1000-2M
- Surface finish
- Immersion gold
Notable processL1–3 / L10–12 blind vias, two laminations, two resin-fill steps, plated edges and castellated holes
03 / 03Six layers. Plated edges.
- Layers
- 6
- Thickness
- 1.60 mm
- Finished copper
- 3/3 oz
- Minimum hole
- 0.30 mm
- Material
- Shengyi S1000-2M
- Surface finish
- Immersion gold
Notable processL1–4 / L5–6 blind vias, two resin-fill steps, plated edges and castellated holes
Board photographs and parameters are taken from JETFGO production information. Aircraft image illustrates the application category; it is not a photograph of a customer installation.
Discuss your drone PCB requirementsAEROSPACE & DEFENSE ELECTRONICS
High-Reliability PCB Manufacturing for Demanding Applications
Aerospace and defense electronics require careful control of PCB materials, electrical interconnections, mechanical construction and manufacturing quality. JETFGO supports multilayer, RF, HDI and rigid-flex PCB fabrication for avionics-related electronics, communication equipment, navigation modules and long-lifecycle control systems. Manufacturing feasibility and applicable quality requirements are reviewed against customer-approved designs.
High-reliability PCB material and stack-up engineering, including laminate selection, copper weight, dielectric properties, thermal expansion compatibility and multilayer construction for demanding operating environments.Controlled-impedance manufacturing for RF and high-speed electronic circuits, including single-ended and differential impedance, reference-plane configuration, transmission-line geometry and material-dependent tolerances.Customer-defined material traceability, component identification, fabrication revision control and documented inspection requirements, including AOI, electrical testing and applicable IPC acceptance criteria.Prototype-to-repeat-production support using approved fabrication files, controlled BOM revisions, material specifications, engineering change procedures and consistent inspection requirements.Plated-through-hole and via reliability review covering copper plating integrity, hole-wall construction, drilling quality, aspect ratio, annular rings and inspection requirements for multilayer PCB assemblies.Material and construction review for thermal cycling environments, including coefficient of thermal expansion (CTE), laminate glass transition temperature (Tg), layer bonding, copper structures and plated-hole stress considerations.PCB construction review for vibration and mechanical shock considerations, including board thickness, mounting geometry, component support, rigid-flex transitions and mechanical clearance requirements. Environmental qualification is performed separately.Rigid-flex PCB manufacturing review for compact aerospace electronics, including polyimide construction, bend-radius requirements, flexible copper configuration, rigid-to-flex interfaces and connector-reduction opportunities.High-frequency PCB manufacturing using suitable Rogers laminate options, with evaluation of dielectric properties, material compatibility, controlled-impedance structures and mixed-dielectric RF/FR-4 stack-ups.Component lifecycle and obsolescence review, including approved manufacturer part numbers, alternate-component evaluation, BOM revision management and procurement traceability for long-service-life electronic equipment.Customer-defined PCB and PCBA inspection requirements covering incoming material verification, AOI, electrical testing, impedance verification, dimensional inspection and additional agreed testing or microsection analysis where available.Manufacturing configuration control through approved Gerber or ODB++ files, fabrication drawings, controlled BOM revisions, engineering change documentation and defined acceptance criteria for repeat production.Manufacturability review of grounding structures, shielding interfaces, reference-plane continuity, signal separation and return-current paths for EMI/EMC-sensitive aerospace electronics. Final electromagnetic compatibility requires product-level validation.Project-specific review of IPC Class 2 or Class 3 acceptance requirements, traceability documentation, special inspection procedures and supplier qualification criteria. AS9100, military-standard and flight-qualification requirements must be verified separately and cannot be assumed from general PCB manufacturing capability.
Soluciones
Directorio de soluciones técnicas
Cada página resuelve una necesidad concreta con capacidades verificables y los archivos necesarios para revisión.
RF-4350
Rogers RO4350 RF PCB
An RF PCB manufacturing solution for aerospace communication modules, navigation-related electronics and high-frequency signal circuits. Rogers RO4350 laminate options support controlled dielectric requirements, with transmission-line geometry, impedance targets, surface finishes and material selection evaluated during engineering review. Application-specific qualification remains subject to customer requirements.
Ver soluciónRFX-06L6-Layer Rigid-Flex PCB
A six-layer rigid-flex PCB manufacturing solution for compact aerospace electronic assemblies, communication modules and navigation-related control electronics. Integrated rigid and flexible regions can reduce connector usage and support space-constrained packaging. Engineering review covers polyimide materials, rigid-flex transitions, bend requirements and mechanical construction.
Ver soluciónLIFE-CYCLELegacy PCB Redesign & Replacement
A manufacturing-oriented PCB reconstruction and replacement solution for long-lifecycle aerospace and defense electronics affected by obsolete components, unavailable materials or missing fabrication documentation. JETFGO evaluates existing PCB samples, BOM information, stack-up requirements and manufacturing feasibility. Replacement suitability requires independent functional, environmental and configuration approval.
Ver soluciónRF-HYBRIDFR-4 + Rogers Hybrid PCB
A mixed-dielectric PCB manufacturing solution combining Rogers RF laminates and FR-4 materials for electronic modules integrating high-frequency circuits with conventional control or digital sections. Manufacturing evaluation covers material compatibility, hybrid lamination, dielectric configuration and controlled-impedance requirements.
Ver soluciónHS-06L6-Layer High-Speed PCB
A six-layer high-speed PCB manufacturing solution for aerospace communication interfaces, control modules and data-processing electronics. Engineering review covers stack-up design, reference-plane continuity, dielectric material selection, controlled impedance and via construction, subject to customer-defined requirements.
Ver soluciónRFQ / DFM
Envíe el requisito. Reciba un plan de suministro fabricable.
Envíe Gerber u ODB++, stackup, material, cantidad, fecha objetivo y pruebas para revisar la viabilidad y cotizar.
Revisión técnicaMaterial y stackupFabricación precisa