Direct answer
PCB buyers should not mandate IEC PAS 63720:2026 on every order. They can use its routing-class framework to align component pitch, via method and routing geometry for rigid boards, but the selected parameters still need project-specific DFM confirmation and contractual acceptance criteria.
What changed
The International Electrotechnical Commission published IEC PAS 63720:2026, Edition 1.0, on August 6, 2026. The 24-page Publicly Available Specification defines standardized routing-parameter tables for rigid circuit boards using mechanically or laser-drilled vias. IEC says the Routing Classes are linked to the pitch of components such as BGAs, QFNs and connectors, and can be integrated into EDA tools to create a common communication framework between designers and board manufacturers.
IEC also draws an important boundary: these Routing Classes are not IPC performance classes. IPC-A-600 addresses printed-board acceptance, while IPC-6012 covers qualification and performance for rigid boards. A routing class therefore describes a design and communication framework; it does not by itself define workmanship acceptance, reliability evidence or supplier qualification.
Why this matters to PCB buyers
Ambiguous routing notes can create quotation differences before fabrication starts. One supplier may interpret a pitch-driven layout through its standard mechanical-drill process, while another may assume laser vias or a different geometry. That can change stackup feasibility, manufacturing route, cost and redesign risk. Using a named routing framework may improve comparison, but only when the drawing, data package and supplier response identify what the class actually controls.
Buyer checks before adoption
Check 1. Confirm scope. Use the PAS only for a rigid-board design within its stated scope; do not extend it to flex, rigid-flex or assembly requirements without separate evidence.
Check 2. Record the exact edition and selected Routing Class in the controlled drawing, design rules and RFQ. Avoid a vague request to follow the latest version.
Check 3. Ask the fabricator to map the class to the quoted via type, drill diameter, annular ring, line and spacing, pad geometry and stackup.
Check 4. Keep performance and acceptance requirements separate. State the applicable IPC document, revision, class, inspection plan, test coupons and any customer-specific limits.
Check 5. Run a documented exception review. If the supplier proposes a different geometry or process, require impact analysis and written approval before data release or substitution.
JETFGO connection
JETFGO's public English site lists rigid multilayer, HDI and high-speed PCB manufacturing, including engineering review of stackups, drilling and controlled requirements. Its HDI page describes microvias, sequential lamination and fine-line routing, while the capability page publishes a technical window for quotation review. These statements do not establish conformity to IEC PAS 63720. Buyers should send the selected routing rules, Gerber or ODB++ data, fabrication drawing and acceptance requirements through the contact page for build-specific confirmation.
Conclusion
IEC PAS 63720 can make routing assumptions easier to communicate, especially around fine-pitch components. The useful procurement control is not the document number alone; it is an agreed mapping from the chosen Routing Class to the quoted manufacturing route and separate acceptance evidence.
Source 1. IEC Webstore, IEC PAS 63720:2026, Rigid circuit board — Routing parameters, published August 6, 2026 https://webstore.iec.ch/en/publication/111572
Source 2. JETFGO, PCB Manufacturing Products and PCBA Services https://jetfgo.online/en/products
Source 3. JETFGO, HDI PCB Manufacturer https://jetfgo.online/en/products/hdi-pcb
Source 4. JETFGO, PCB Manufacturing Capabilities https://jetfgo.online/en/capabilities
Source 5. JETFGO, Engineering RFQ and Contact https://jetfgo.online/en/contact