TL;DR
No. Infineon introduced new OptiMOS 7 automotive MOSFETs on October 27, 2026, retaining the established 10 × 12 mm TOLL footprint and stating that the products are available. Their lower on-resistance justifies evaluating a substitution, but the shared package outline does not prove electrical, thermal, assembly or system-level equivalence for a specific PCBA.
What changed on October 27
The new 40 V, 80 V and 100 V devices have stated RDS(on) values of 0.24 mΩ, 0.57 mΩ and 0.88 mΩ respectively. Infineon reports reductions of 65%, 48% and 37% compared with its referenced previous-generation OptiMOS TOLL products.
The devices combine OptiMOS 7 technology with clip-based interconnection. Infineon also reports improved capacitance and gate-charge characteristics and a tighter gate-threshold-voltage range intended to support more balanced current sharing in parallel configurations.
The target applications include high-current 12 V and 48 V automotive systems such as electric power steering, battery-disconnect switches, motor drives and high-voltage-to-low-voltage DC-DC converters.
Why the same footprint is not sufficient approval
Infineon states that the established TOLL form factor can avoid moving to a larger package or redesigning the board layout. That statement does not establish that every new orderable part can replace a buyer’s existing MOSFET without controlled engineering review.
The exact datasheets must be compared for rated voltage, maximum RDS(on) under relevant temperature and gate-drive conditions, safe operating area, avalanche behavior, gate charge, capacitance, gate-threshold tolerance, thermal impedance and terminal mapping. The newsroom announcement does not provide the complete test conditions or exact orderable-part availability needed for this comparison.
Electrical and thermal decision
Recalculate conduction loss, switching loss, junction temperature, current sharing and fault response using worst-case values for the intended circuit. Do not use the headline resistance reduction alone.
If the lower resistance allows fewer parallel MOSFETs, treat that as a circuit redesign rather than a drop-in substitution. The revised design needs new thermal, transient, protection and functional validation.
Assembly-quality decision
Confirm the exact package drawing, recommended land pattern, solder-paste design, reflow requirements and moisture-handling conditions for the selected part. Agree measurable acceptance criteria for solder coverage, voiding and alignment, together with the appropriate AOI, X-ray, electrical and functional-test evidence.
A shared 10 × 12 mm outline does not independently confirm that an existing stencil, process window or inspection program remains acceptable.
Sourcing and change-control decision
Lock the complete manufacturer part number and approved source before quotation or production. Record physical quantity or allocation, lot and date-code traceability, lifecycle status, product-change notification handling and the customer approval required for the substitution.
Infineon’s statement that products are available is a manufacturer-level status. It does not prove stock, price or lead time for every part number, quantity, channel or region.
Where JETFGO’s public pages fit
JETFGO’s PCB Assembly page describes pre-production review of the BOM, Gerber data, placement files, assembly drawings, component availability and test requirements. It also lists project-dependent inspection and testing options including SPI, AOI, X-ray, electrical testing, ICT and FCT.
Its Electronic Component Sourcing page describes MPN review, customer-approved alternative evaluation, traceability control and supply coordination. These published workflows are relevant to a controlled substitution review, but they do not establish that JETFGO has stocked, quoted or validated a specific OptiMOS 7 device for a particular automotive program.
Bottom line
Do not approve the new MOSFET solely because it retains the TOLL footprint. Approve it only after the exact part, worst-case electrical and thermal results, assembly process, inspection evidence, sourcing route and system validation meet the project’s documented requirements.
References
Infineon Technologies, October 27, 2026, Infineon expands its OptiMOS 7 automotive MOSFETs offering with the ultra-low on-resistance TOLL package https://www.infineon.com/technology-news/2026/inftn202610-020
Related JETFGO pages
PCB Assembly and PCBA Manufacturing Services https://jetfgo.online/en/products/pcb-assembly
Electronic Component Sourcing for PCBA https://jetfgo.online/en/products/component-sourcing