TL;DR
On October 29, 2026, TrendForce reported that high-end MLCC shortages are expected to be most severe in the first and second quarters of 2027. The pressure mainly concerns high-capacitance parts used around CPUs, memory power systems and some optical-communications modules, not every capacitor or PCBA. Buyers should require part-specific commercial evidence before accepting a price increase.
What changed on October 29
TrendForce says AI inference demand is increasing requirements for standard high-capacitance MLCCs across CPU motherboards and memory modules. ODMs expect shortages of high-end MLCCs to be most severe in Q1 and Q2 2027, with constraints also extending to communications-grade components used in optical modules.
The market is not moving uniformly. TrendForce reports that spot prices for low- to mid-capacitance consumer-grade MLCCs fell approximately 5% in early October before temporarily stabilizing. Major notebook ODMs also expect their Q4 2026 orders to decline by an average of 10% to 15% year over year.
Cost pressure remains relevant. TrendForce reports that Japan’s import price index rose 24.5% year over year in September, while nickel, copper and silver used in MLCC electrodes remain exposed to rising costs. It also says meaningful new Murata capacity is unlikely before 2028.
Should buyers accept a blanket PCBA price increase?
No. The new data supports targeted repricing of affected MLCC lines, not a percentage increase across an entire BOM, finished PCBA or bare PCB.
TrendForce expects constrained suppliers to retain greater negotiating leverage and says discussions for Q1 2027 pricing are scheduled to begin in November 2026. That is an outlook, not confirmation that every Japanese supplier has announced an increase or that every MLCC specification will become more expensive.
Decision 1 — Identify the exposed BOM lines
Separate high-capacitance and AI- or communications-grade MLCCs from general consumer components. For each potentially affected line, freeze the capacitance, case size, rated voltage, dielectric, tolerance, temperature rating, qualification grade and complete manufacturer part number.
Decision 2 — Require dated commercial evidence
Ask for the approved source, physical quantity or allocation, unit price, price-validity date, lead time and applicable purchasing terms. A market report does not replace an authorized-source quotation, and its figures are not a JETFGO price, inventory or delivery commitment.
Decision 3 — Control alternatives before comparing price
A lower-priced MLCC is not automatically equivalent. Confirm voltage derating, effective capacitance under DC bias, temperature behavior, mechanical requirements, lifecycle status and customer approval before substitution. Include any PCB, assembly, inspection and validation changes when comparing total cost.
Where JETFGO’s public pages fit
JETFGO’s Electronic Component Sourcing page describes BOM-based MPN review, approved-alternative control, traceability requirements and coordination with PCBA production. Its PCB Assembly page describes reviewing component availability and test requirements before production.
These pages provide a workflow for project-specific review. They do not establish current stock, pricing or lead time for a particular MLCC.
Bottom line
The October 29 data justifies closer review of high-capacitance MLCCs used in AI and communications hardware, especially for builds extending into the first half of 2027. It does not justify a universal capacitor or PCBA price increase. Buyers should approve any adjustment only after the affected BOM lines, quantities, sources and quotation dates are documented.
References
TrendForce, October 29, 2026 https://www.trendforce.com/presscenter/news/20261029-13284.html
Related JETFGO pages
Electronic Component Sourcing for PCBA https://jetfgo.online/en/products/component-sourcing
PCB Assembly and PCBA Manufacturing Services https://jetfgo.online/en/products/pcb-assembly